- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 26/55 - Working by transmitting the laser beam through or within the workpiece for creating voids inside the workpiece, e.g. for forming flow passages or flow patterns
Patent holdings for IPC class B23K 26/55
Total number of patents in this class: 85
10-year publication summary
|
5
|
8
|
6
|
15
|
11
|
6
|
12
|
10
|
7
|
2
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Corning Incorporated | 9932 |
16 |
| Agc, Inc. | 4029 |
7 |
| Disco Corporation | 1745 |
5 |
| SCHOTT AG | 1675 |
5 |
| Corning Laser Technologies GmbH | 8 |
3 |
| East China Normal University | 158 |
3 |
| IPG Photonics Corporation | 494 |
3 |
| Roland DG Corporation | 337 |
3 |
| Chongqing Institute of East China Normal University | 46 |
3 |
| Carl Zeiss SMT GmbH | 2646 |
2 |
| Hirosaki University | 140 |
2 |
| ROI Optoelectronics Technology CO, LTD. | 32 |
2 |
| General Electric Company | 18133 |
1 |
| LG Chem, Ltd. | 17205 |
1 |
| Sony Corporation | 32931 |
1 |
| The Boeing Company | 19843 |
1 |
| Hitachi, Ltd. | 16452 |
1 |
| Applied Materials, Inc. | 16587 |
1 |
| Seagate Technology LLC | 4228 |
1 |
| Massachusetts Institute of Technology | 9795 |
1 |
| Other owners | 23 |